1. Cleanroom PCB Assembly Static Control
Precision ionization during the manual assembly and cleaning of printed circuit boards and sensitive electronic components.
Problem Solved
Eliminates electrostatic discharge (ESD) risks that damage micro-circuitry and neutralizes static fields that attract microscopic dust, preventing yield failures.
ESD preventionPCB cleaningHigh-frequency ionizationParticulate contamination control
2. Optical Film Lamination and Handling
Spot neutralization for plastic films, glass substrates, and LCD screens prior to lamination or inspection processes.
Problem Solved
Resolves static cling issues that cause sheets to adhere improperly or trap airborne debris between layers, ensuring optical clarity and adhesion quality.
Static cling eliminationOptical film processingDust attraction preventionLamination defects
3. Injection Molded Part Detachment
Targeted air blow-off for resin parts immediately after ejection from molds or during transfer on conveyors.
Problem Solved
Overcomes strong electrostatic adhesion that prevents parts from releasing from molds or causes them to stick to grippers, reducing cycle time and jamming.
Injection moldingResin static neutralizationMold releasePulsed air blow