1. Precision Semiconductor Manufacturing Equipment
Expanding the multi-axis motion control footprint for semiconductor wafer handling and nanoscale precision alignment platforms.
Problem SolvedPhysical space constraints and hard limits on the main CPU rack prevent the addition of necessary analog/encoder modules. The CK3W-EXS02 safely distributes the multi-axis I/O load across a separate chassis while maintaining ultra-fast synchronized data acquisition.
Nanoscale positioningMulti-Axis ControlExpansion RackPMAC Architecture
2. Advanced Automated Optical Inspection (AOI) Systems
Enhancing the core control architecture of high-speed AOI machines that require multiple camera positioning axes and synchronized Galvo laser interfaces.
Problem SolvedOvercomes processing and modular bottleneck issues in the main controller by allowing additional axis interfaces to be networked seamlessly without degrading the 50 μs/5-axis feedback speed.
Galvo Scanner controlAOI SystemHigh-speed feedbackEtherCAT expansion
3. High-Speed Packaging & CNC Machining
Networking auxiliary CNC axes, digital I/O units, and synchronized servo drives in harsh, vibration-prone industrial environments.
Problem SolvedIndustrial CNC and packaging environments frequently experience heavy mechanical shocks and broad temperature fluctuations. Built to withstand 147 m/s² shock impacts and ambient temperatures up to 55°C, this unit provides a highly resilient extension for critical automated tooling.
Vibration Resistance IEC 60068CNC machiningServo synchronizationShock resistant 147 m/s²