1. Semiconductor Die Bonding Systems
High-precision placement of delicate silicon dies onto substrates requires extremely fast settling times and zero overshoot to prevent mechanical stress.
Problem SolvedThe 3.2 kHz velocity response combined with real-time auto-tuning minimizes trajectory tracking error and reduces settling time to milliseconds, allowing high-throughput bonding without damaging microchips.
Die BondingSettling TimeTrajectory Tracking3.2 kHz ResponseEtherCAT Synchronization
2. High-Speed Cartesian Pick-and-Place Robots
Packaging lines require high-speed synchronization of multiple small Cartesian axes to pick, align, and place products into trays.
Problem SolvedThe compact 40mm wide chassis enables tight side-by-side mounting of multiple drives within small control cabinets, while the 125 μs EtherCAT cycle time coordinates multi-axis interpolations seamlessly.
Cartesian RobotChassis MountingMulti-Axis Synchronization125 μs Cycle TimeHigh-Speed Packaging
3. Precision Adhesive and Sealant Dispensing Gantries
Applying uniform paths of adhesive on complex electronic enclosures requires constant dispensing speeds despite changing mechanical friction and direction changes.
Problem SolvedAdvanced friction torque compensation and 23-bit high-resolution feedback (8,388,608 pulses/rev) maintain ultra-smooth motor rotation and constant linear speed, eliminating adhesive pooling and gaps.
Adhesive DispensingFriction Compensation23-bit EncoderSmooth RotationPath Accuracy