Panasonic EX-L221 Ultra-compact Spot Reflective Laser Sensor

Technical Overview

Spot reflective laser sensor with 0.01mm minute object detection, 45-300mm sensing range, ø1mm spot, 0.02mm repeatability, 12-24VDC, IP67. Amplifier built-in.

Key Features

Ultra-compact design with integrated amplifier.
Class 1 laser product (IEC/EN/JIS/GB/KS/FDA compliant) for safe usage without area separation.
High-precision detection of minute objects (as small as 0.01 mm diameter for spot reflective type).
Stable sensing due to customized IC and optical design, including molded aspheric glass lens.
Small receiver aperture (ø0.5 mm) for precision detection by eliminating errant beams.
IP67 protection structure for robust use in water and dust environments.
Low current consumption compared to LED light sources.
Switchable Light-ON/Dark-ON output operation via input for reduced ordering mistakes and spare parts.
M3 screw mounting with metal sleeves for secure tightening (0.5 N·m).
Increased conductor thickness (0.15 mm²) for easier crimping and improved tensile strength.
Easy beam-axis alignment through visual confirmation of red spot on sensing object.

Technical Specification Matrix

Parameter	Value
Type	Spot reflective
Sensing Range	45 to 300 mm (1.772 to 11.811 in)
Emission Spot Size (Typical)	ø1 mm (Ø0.039 in) or less (at 300 mm sensing distance)
Sensing Object (Minimum)	Gold wire of Ø0.01 mm (Ø0.0004 in)
Repeatability (Perpendicular to sensing axis)	0.2 mm (0.0080 in) or less
Repeatability (Typical at 100-200mm)	0.02 mm (0.0008 in) or less
Supply Voltage	12 to 24 V DC ±10% (Ripple P-P 10% or less)
Current Consumption	15 mA or less
Output Type	NPN open-collector transistor
Max Sink Current	50 mA
Applied Output Voltage	26.4 V DC or less (between output and 0 V)
Residual Output Voltage	2 V or less (at 50 mA sink current) / 1 V or less (at 16 mA sink current)
Output Operation	Light-ON / Dark-ON selectable
Short-circuit Protection	Incorporated (short-circuit protection / inverse polarity protection)
Response Time	0.5 ms or less
Protection Structure	IP67 (IEC)
Ambient Temperature	-10 to +55 °C (+14 to +131 °F) (No dew condensation or icing allowed)
Storage Temperature	-30 to +70 °C (-22 to +158 °F)
Ambient Humidity	35 to 85% RH (Storage: 35 to 85% RH)
Ambient Illuminance	Incandescent light: 3,000 lx or less at light-receiving face
Voltage Withstandability	1,000 V AC for one min. between all supply terminals connected together and enclosure
Insulation Resistance	20 MΩ or more, with 250 V DC megger
Vibration Resistance	10 to 500 Hz frequency, 1.5 mm double amplitude (10 G max.) in X, Y and Z directions for two hours each
Shock Resistance	500 m/s² acceleration (50 G approx.) in X, Y and Z directions three times each
Emitting Element	Red semiconductor laser Class 1 (IEC / EN / JIS / GB / KS / FDA), Maximum output: 2 mW, Peak emission wavelength: 655 nm
Enclosure Material	Polybutylene terephthalate
Front Cover Material	Acylic
Lens Material	Glass
Indicator Part Material	Polyarylate
Cable Type	0.15 mm² 4-core cabtyre cable
Cable Length	2 m
Cable Extension	Up to total 50 m (164.042 ft) with 0.3 mm² or more cable
Physical Weight (kg)	0.05
Dimensions L x W x H (cm)	2.74 x 0.82 x 1.33

Industrial Applications

1. Precision Component Alignment in Micro-assembly

In automated micro-assembly lines for electronics or medical devices, the EX-L221 can precisely detect and confirm the alignment of miniature components, such as small pins or wires, before bonding or placement. Its minute object detection capability (0.01mm diameter) and high repeatability (0.02mm) are critical for these exacting tasks.

Problem Solved

Prevents misalignment errors and ensures the correct positioning of extremely small parts, reducing rework and improving product quality in high-precision manufacturing.

Micro-assemblycomponent alignmentminiature part detectionhigh repeatabilityprecision manufacturing

2. Quality Control for Fine Wire or Filament Presence

For industries producing fine wires, fibers, or filaments, the EX-L221 is ideal for non-contact presence detection and breakage monitoring. Its ability to detect objects down to 0.01mm diameter with a tight ø1mm laser spot ensures that even the thinnest materials are reliably sensed across its 45-300mm range.

Problem Solved

Identifies missing or broken threads, wires, or filaments on production lines, preventing defects in textiles, cabling, or medical tubing manufacturing processes.

Fine wire detectionfilament monitoringbreakage detectionquality inspectionnon-contact sensing

3. Wafer and PCB Edge Detection in Semiconductor Fabrication

In semiconductor manufacturing, precise edge detection of silicon wafers or printed circuit boards (PCBs) is crucial for robotic handling and processing. The EX-L221's spot reflective sensing type and high accuracy enable it to reliably detect the edges of highly reflective or sensitive surfaces without contact, within a sensing range of up to 300mm.

Problem Solved

Ensures accurate positioning and handling of delicate semiconductor wafers and PCBs, minimizing damage and enabling precise robotic manipulation for subsequent manufacturing steps.

Wafer edge detectionPCB positioningsemiconductor manufacturingrobotic handlingnon-contact measurement