Panasonic EX-19A Ultra-slim Thru-beam Photoelectric Sensor

Technical Overview

Ultra-slim 3.5mm thru-beam photoelectric sensor, NPN output, 1m sensing range, detects Ø2mm objects, 0.5ms response, IP67 rated, 12-24VDC.

Key Features

Amplifier built-in, extraordinarily small and slim size.
Smallest body, just 3.5 mm (0.138 in) thick.
Flexible front sensing mounting.
Long sensing range of 1 m (3.281 ft) with narrow beam.
Detects objects as small as Ø2 mm (Ø0.079 in).
Electric power saving with up to 65% reduction.
High-speed response time of 0.5 ms.
Incorporated inverter countermeasure circuit.
Waterproof IP67 rating.
Red LED beam for easy alignment.
Compliant with ISO 13849-1: 2015 Category 1 PLc safety standards.

Technical Specification Matrix

Parameter	Value
Type	Thru-beam standard type, Front sensing
Sensing Range	1 m (3.281 ft)
Minimum Sensing Object	Ø2 mm (Ø0.079 in) opaque object
Hysteresis	0.05 mm (0.002 in) or less
Repeatability (perpendicular to sensing axis)	0.05 mm (0.002 in) or less
Supply Voltage	12 to 24 V DC ±10%
Ripple	P-P 10% or less
Current Consumption (Emitter)	10 mA or less
Current Consumption (Receiver)	10 mA or less
Output Type	NPN open-collector transistor
Maximum Sink Current	50 mA
Applied Output Voltage	30 V DC or less (between output and 0 V)
Residual Output Voltage (at 50 mA sink current)	2 V or less
Residual Output Voltage (at 16 mA sink current)	1 V or less
Utilization Category	DC-12 or DC-13
Short-circuit Protection	Incorporated
Response Time	0.5 ms or less
Operation Indicator	Orange LED (lights up when the output is ON)
Incident Beam Indicator	Green LED (lights up under stable light received condition or stable dark condition)
Pollution Degree	3 (Industrial environment)
Protection Rating	IP67 (IEC)
Ambient Temperature Range	-25 to +55 °C (-13 to +131 °F) (No dew condensation or icing allowed)
Storage Temperature Range	-30 to +70 °C (-22 to +158 °F)
Ambient Humidity Range	35 to 85% RH
Storage Humidity Range	35 to 85% RH
Ambient Illuminance	Incandescent light: 3,000 lx or less at the light-receiving face
Voltage Withstandability	1,000 V AC for one min. (between all supply terminals connected together and enclosure)
Insulation Resistance	20 MΩ, or more, with 250 V DC megger (between all supply terminals connected together and enclosure)
Vibration Resistance	10 to 500 Hz frequency, 3 mm (0.118 in) double amplitude in X, Y and Z directions for two hours each
Shock Resistance	500 m/s² acceleration (50 G approx.) in X, Y and Z directions three times each
Emitting Element	Red LED
Peak Emission Wavelength	680 nm (0.027 mil), modulated
Enclosure Material	Polyarylate
Lens Material	Polyarylate
Cable Type	0.1 mm² 3-core cabtyre cable
Cable Length	2 m (6.562 ft)
Applicable Regulations/Certifications	CE Marking (EMC Directive, RoHS Directive), UKCA Marking (EMC Regulations, RoHS Regulations), ISO 13849-1 (Category 1, PLc), UL Recognition certification
Physical Weight (kg)	0.02
Dimensions L x W x H (cm)	1.45 x 1 x 0.35

Industrial Applications

1. High-Speed Component Counting on Conveyor Belts

In automated assembly lines, high-speed counting of small electronic components or fasteners is crucial for inventory control and production monitoring. The EX-19A's ultra-slim design allows installation in tight spaces, while its 0.5 ms response time and 1m sensing range enable accurate detection of rapidly moving parts.

Problem Solved

Prevents miscounts and bottlenecks in high-speed production lines by precisely detecting small, fast-moving objects, ensuring efficient material flow and quality control.

High-speed detectioncomponent countingautomated assemblyconveyor systemsthroughput optimization

2. Precision Positioning and Alignment of PCBs

The EX-19A is highly suitable for accurately positioning Printed Circuit Boards (PCBs) or other flat substrates in electronics manufacturing, as shown in the datasheet's 'Positioning of PCBs' application. Its ability to detect objects as small as Ø2 mm and its precise repeatability (0.05 mm) ensure correct alignment, even in applications with minimal clearances.

Problem Solved

Eliminates misalignment errors during PCB assembly, soldering, or testing, which can lead to costly rework or product defects.

PCB positioningelectronics manufacturingprecision alignmentsmall object detectionrobotic guidance

3. Wafer Cassette Presence Verification in Semiconductor Processing

In semiconductor fabrication, confirming the presence of thin wafer cassettes or trays (as illustrated in the 'Detecting wafer cassette' application on Page 3) within processing stations is critical. The EX-19A's ultra-slim profile allows it to fit into confined machine spaces, and its stable thru-beam detection across a 1m range reliably verifies cassette placement without interference.

Problem Solved

Ensures automated systems do not attempt operations on empty or improperly loaded wafer cassettes, preventing equipment damage and maintaining process integrity in cleanroom environments.

Semiconductor manufacturingwafer handlingcassette detectioncleanroom automationprocess verification