Basler C12-1624-25M Fixed Focal Lens

USD 434.77

Premium 16mm C-mount fixed focal lens for 1.2″ sensors. Supports 25 MP resolution, manual F2.4-F16 iris, and 100 mm minimum working distance.

SKU N/A Category
Top Brands > Basler > Basler Fixed Focal Lenses

Basler C12-1624-25M Fixed Focal Lens

Model Identifier C12-1624-25M
Official Part Number 2200001662
GTIN Standard NA

Technical Overview

Premium 16mm C-mount fixed focal lens for 1.2" sensors. Supports 25 MP resolution, manual F2.4-F16 iris, and 100 mm minimum working distance.

Key Features

  • High optical resolution up to 25 Megapixels for capturing ultra-fine structures
  • Large 1.2" sensor format compatibility, minimizing vignetting and distortion
  • Fixed focal length of 16 mm with manual iris control from F2.4 to F16
  • Short minimum working distance of 100 mm for close-up imaging
  • Optimized for pixel pitches as small as 2.71 µm
  • Standard C-mount compatibility for secure camera integration

25 Megapixel High-Resolution Optical Performance

Technical Specification Matrix

ParameterValue
Lens TypeFixed Focal Lens
Focal Length16 mm
Mount TypeC-mount
Sensor Format Compatibility1.2"
Resolution25 MP
Minimum Working Distance100 mm
Iris RangeF2.4 - F16
Iris TypeManual
Pixel Pitch2.71 µm
Wavelength RangeVisible
Coaxial Illumination OptionNo
Product LinePremium
Warranty36 Months
Physical Weight (kg)0.215
Dimensions L x W x H (cm)0 x 0 x 0

Industrial Applications

1. High-Precision PCB Inspection

Checking microscopic solder joints and component placement on dense printed circuit boards. The high-resolution 25 MP capability and 2.71 µm pixel pitch allow the machine vision system to capture fine micro-level details.

Problem Solved

Prevents false failures and undetected defects on complex PCBs where standard lenses lack the resolving power for tiny components.

25 MP ResolutionPCB InspectionPixel Pitch 2.71 µmFixed Focal Lens

2. Close-up Semiconductor Wafer Alignment

Aligning and inspecting semiconductor wafers at extremely close ranges. The low minimum working distance of 100 mm enables compact system integration without sacrificing image clarity.

Problem Solved

Resolves space constraints in wafer manufacturing tools by allowing high-resolution imaging at short distances.

Minimum Working Distance 100 mmWafer InspectionManual IrisC-mount

3. High-Speed Packaging Thread Inspection

Inspecting physical defects and thread accuracy on bottling and packaging lines. Using a large 1.2" sensor format ensures minimal vignetting and consistent edge-to-edge resolution across the entire field of view.

Problem Solved

Eliminates optical distortion at the image edges, ensuring that threads on the outer boundary of the object are measured as accurately as those in the center.

1.2" Sensor FormatLow VignettingLow DistortionPackaging Inspection
Select your currency