Festo ESS-10-BS Vacuum Suction Cup

Technical Overview

The Festo ESS-10-BS (part number 189376) is a high-performance vacuum suction cup designed for precision pneumatic handling systems. It features a 10 mm diameter round bellows shape with 1.5 convolutions, making it ideal for adapting to uneven workpiece surfaces with a minimum radius of 20 mm. The suction cup includes a 4 mm height compensator to ensure gentle and secure contact during pick-and-place operations. Constructed from durable VMQ (silicone) with a Shore hardness of 50, it is capable of operating in extreme ambient temperatures ranging from -30 °C to 180 °C. The robust nickel-plated brass M4 threaded top connection ensures a reliable vacuum seal. Delivering a holding force of 4.7 N at a nominal operating pressure of -0.7 bar, this highly efficient suction cup operates smoothly with atmospheric air and offers low corrosion stress (CRC 1) alongside VDMA24364 zone III LABS conformity.

Key Features

10 mm diameter round bellows shape with 1.5 convolutions
Constructed from VMQ (silicone) with a Shore hardness of 50 +/- 5
Operating pressure range: -0.95 bar to 0 bar (-95 kPa to 0 kPa)
Delivers 4.7 N holding force and 2.5 N lateral force at nominal pressure
Wide ambient operating temperature range from -30 °C to 180 °C
Integrated M4 threaded top connection made of nickel-plated brass
Offers 4 mm height compensation and supports a 20 mm minimum workpiece radius
LABS (PWIS) conformity to VDMA24364 zone III for sensitive environments

Technical Specification Matrix

Parameter	Value
Suction Cup Diameter	10 mm
Suction Cup Shape	Round bellows, 1.5 convolutions
Vacuum Connection	M4 Thread (Top)
Material (Suction Cup)	VMQ (Silicone)
Material (Screwed Plug)	Nickel-plated brass
Holding Force	4.7 N (at -0.7 bar nominal)
Lateral Force	2.5 N (at -0.7 bar nominal)
Operating Pressure	-0.95 to 0 bar
Height Compensation	4 mm
Min. Workpiece Radius	20 mm
Suction Cup Volume	0.38 cm³
Ambient Temperature	-30 °C to 180 °C
Shore Hardness	50 ± 5
Weight	1.8 g

Industrial Applications

1. Semiconductor Wafer and Chip Handling

Used in electronics manufacturing for precise pick-and-place transfer of delicate silicon wafers and microchips, taking advantage of the static-friendly VMQ material and 4 mm height compensation to prevent damage to fragile substrates.

Problem Solved

Eliminates the risk of micro-fractures in delicate electronics components by ensuring gentle contact and conforming to slight surface variations during rapid automated transfers.

Pick-and-placeHeight compensationVMQ SiliconeSemiconductor handling

2. Automated Food Packaging Verification

Integrated into end-of-arm tooling on high-speed delta robots handling sealed food pouches or uneven packages, utilizing the 1.5 convolutions round bellows to grasp varying surface profiles safely.

Problem Solved

Addresses the challenge of gripping non-uniform or highly contoured lightweight packaging without puncturing or dropping the items on fast conveyor belts.

End-of-arm toolingRound bellows1.5 convolutionsVDMA24364 zone III

3. High-Temperature Molding Extraction

Applied in plastic injection molding machines for extracting hot, newly formed lightweight plastic components directly from the mold, supported by the suction cup's robust high-temperature tolerance up to 180°C.

Problem Solved

Standard suction cups degrade rapidly or melt upon contact with freshly molded plastics; the silicone construction ensures continuous operation and long lifespan in hot environments.

High temperature180°C ambientInjection moldingVacuum extraction