Panasonic AFPXHC30TD Programmable Controller

Technical Overview

Compact 24 VDC programmable controller with 16 inputs, 14 PNP transistor outputs, 32 k steps program capacity, and 4-axis 100 kHz high-speed pulse output.

Key Features

Compact terminal block type controller for space-saving integration
High-speed operation with 0.04 µs/step basic instruction (ST instruction)
Large capacity program memory of 32 k steps
Max. I/O points: 300 (expandable to 382 with FP0R expansion units)
Supports up to 4 add-on cassettes for enhanced functionality
Communication port with Max. 5 channels, compatible with Modbus-RTU master/slave
PLC link for sharing bit and word data with up to 16 FP-XH units
16-point input of 24 V DC
14-point 0.5 A/24 V DC PNP transistor output

Technical Specification Matrix

Parameter	Value
Power Supply	24 V DC
Input Points	16-point input of 24 V DC
Output Points	14-point output of transistor (PNP)
Output Current/Voltage	0.5 A / 24 V DC
Program Capacity	32 k steps
Basic Instruction Speed (ST instruction)	0.04 µs/step (up to 7 k steps)
High-Level Instruction Speed (F0MV)	0.22 µs/step (up to 7 k steps)
Multi-axis Positioning Control	Up to 4 axes (for C30), built-in 100 kHz high-speed pulse output
Max. I/O Points	300 points (382 points with FP0R expansion units)
Operating Ambient Temperature	0 to +55 °C
Storage Ambient Temperature	-40 to +70 °C
Operating Ambient Humidity	10 to 95% RH (at +25 °C, non-condensing)
Vibration Resistance	5 to 8.4 Hz, 3.5 mm single amplitude; 8.4 to 150 Hz, 9.8 m/s² acceleration
Shock Resistance	147 m/s² (4 times each in X, Y and Z directions)
Noise Resistance	1,000 V [P-P] with pulse widths of 50 ns and 1 µs
Over-voltage Category	Category II
Level of Contamination	2
Physical Weight (kg)	0
Dimensions L x W x H (cm)	13 x 8.2 x 9

Industrial Applications

1. High-Speed Packaging Line Automation

The Panasonic FP-XH C30TD's 0.04 µs/step basic instruction speed and 4-axis 100 kHz pulse output control enable precise, synchronized motion for fast-moving packaging machinery. Its compact size facilitates integration into existing or new production lines with limited space.

Problem Solved

Achieves highly accurate and synchronized control of multiple axes (e.g., conveyors, pick-and-place robots, sealing mechanisms) in high-throughput packaging operations, leading to minimized cycle times and improved overall efficiency.

Packaging automationPick-and-placeSynchronized motion controlHigh-speed processingMulti-axis positioning

2. Semiconductor Wafer Handling System

Leveraging its 4-axis 100 kHz pulse output control, the FP-XH C30TD is suitable for managing the precise and delicate movements required by robotic arms or X-Y tables in semiconductor manufacturing environments, such as wafer loading, positioning, and unloading. The PNP output type ensures compatibility with common sensors and actuators in cleanroom settings.

Problem Solved

Provides accurate and repeatable motion control for critical and delicate wafer handling processes, minimizing potential damage and ensuring high precision in semiconductor fabrication.

Wafer handlingSemiconductor manufacturingPrecision positioningX-Y table controlRobotic arm controlPNP output

3. Compact Machine Tool Control

The compact form factor of the FP-XH C30TD combined with its built-in multi-axis control capabilities (up to 4 axes with 100 kHz pulse output) makes it an ideal solution for controlling smaller CNC machines, engraving equipment, or specialized machining heads. Its high-speed processing ensures rapid execution of complex machining programs.

Problem Solved

Enables cost-effective, precise, and responsive control for compact machine tools, facilitating intricate machining operations with faster cycle times and enhanced accuracy in small-scale manufacturing.

CNC controlMachine tool automationEngraving systemsPrecision machiningG-code executionCompact machine control