Panasonic EX-L211-P Ultra-Compact Laser Sensor

Technical Overview

PNP thru-beam laser sensor with 1m range, 0.3mm min object detection, IP67 enclosure, and built-in amplifier.

Key Features

Ultra-compact dimensions (W8.2 x H23.4 x D12 mm) ideal for narrow installations
Highly precise detection of minute objects down to 0.3 mm in diameter
Safe and visible Class 1 red semiconductor laser with a 6 x 4 mm spot at 1m
Selectable Light-ON or Dark-ON operation via wiring configuration
Built-in amplifier and integrated potentiometer for fine sensitivity adjustment
Rugged IP67 environmental rating with durable PBT housing
Ultra-fast response time of 0.5 ms or less for high-speed production lines

Technical Specification Matrix

Parameter	Value
Sensing Range	1 m
Sensing Method	Thru-beam
Output Configuration	PNP open-collector
Supply Voltage	12 to 24 V DC ±10% (Ripple P-P 10% or less)
Current Consumption	Emitter: 10 mA or less, Receiver: 10 mA or less
Laser Class	Class 1 (IEC / FDA)
Laser Wavelength	655 nm (Red semiconductor laser)
Maximum Output Power	390 µW
Minimum Sensing Object	ø0.3 mm (typical)
Repeatability	Perpendicular to sensing axis: 0.05 mm or less (Typical: 0.01 mm)
Response Time	0.5 ms or less
Enclosure Rating	IP67 (IEC)
Operating Temperature	-10 to +55 °C
Housing Material	Polybutylene terephthalate (PBT) case, Acrylic front cover, Glass lens
Indicator LEDs	Orange LED (Output ON), Green LED (Stability on receiver, Power on emitter)
Connection Method	2 m cabled (4-core cabtyre cable)
Physical Weight (kg)	0.08
Dimensions L x W x H (cm)	1.2 x 0.82 x 2.34

Industrial Applications

1. High-Speed Semiconductor Lead Frame Inspection

Checking for bent, missing, or misaligned pins on semiconductor integrated circuit lead frames during the die bonding process.

Problem Solved

Minute lead frame pins down to 0.3 mm need to be scanned in extremely tight mechanical areas. Standard proximity or bulky laser sensors cannot fit or offer sufficient resolution. The EX-L211-P integrates seamlessly into tight crevices (W8.2 x H23.4 x D12 mm) and uses its highly precise Class 1 laser spot to identify sub-millimeter lead defects.

Lead Frame Inspection0.3mm Target DetectionSemiconductor AssemblyHigh-Precision Laser Alignment

2. Precision Medical Syringe Needle Presence Verification

Ensuring the correct assembly and presence of ultra-thin medical syringe needles before final sterile packaging.

Problem Solved

Extremely thin steel needles must be validated at high speeds without any mechanical contact to prevent contamination or damage. The thru-beam configuration with typical 0.01 mm repeatability ensures that missing or improperly fitted needles are caught on the line within 0.5 ms.

Medical PackagingNeedle Presence Verification0.01mm RepeatabilityNon-Contact Optical Sensing

3. Food & Beverage Cap-Seal Inspection on Bottling Lines

Detecting the presence of thin transparent neck seals or plastic outer caps on beverage bottles moving at high conveyor speeds.

Problem Solved

Standard photoelectric sensors are often falsely triggered by light reflections from bottle moisture or fail due to high humidity. The EX-L211-P features an IP67 rating that prevents moisture ingress from washdowns, and a visible Class 1 beam spot that enables rapid alignment and high-contrast edge detection.

IP67 Washdown ProtectionCap-Seal Detection0.5ms Response TimeHigh-Speed Bottling Lines