1. Micro-component positioning in semiconductor assembly
Alignment of miniature electronic components, lead frames, and microchips on high-speed indexing pick-and-place lines.
Problem SolvedEliminates physical misalignment of micro-scale workpieces. The 0.02 mm repeatability and tiny 1 mm beam spot ensure sub-millimeter positioning accuracy without needing contact.
repeatabilityspot reflectiveClass 1 lasersemiconductor assembly
2. Detection of fine wire breakage in spooling machinery
Real-time presence and breakage monitoring of fine metal or gold wires in automated textile, sensor, or electronic cable manufacturing lines.
Problem SolvedSolves the limitation of standard photoelectric sensors which fail to detect extremely thin objects. The capacity to sense a ø0.01 mm gold wire coupled with a 0.5 ms response time prevents immediate wrap-around damage.
minimum sensing object0.5 ms response timeClass 1 laserwire breakage
3. Space-constrained vial detection in automated medical packaging
Detecting the arrival and presence of opaque or translucent medical packaging tubes inside dense machine spaces subject to frequent washdowns.
Problem SolvedFits directly into compact mechanical frameworks due to its ultra-compact dimensions (W8.2 x H23.4 x D12 mm) and prevents water damage during sterile clean-in-place operations via its IP67 housing.
ultra-compactIP67 waterproofPBT enclosurevial detection